LaBoMaP Directory PhD students 2022 Thesis Defenses
XIANG Xu
PHD HSM Team
Doctoral advisors
- Jun ZHANG
- José OUTEIRO
Partner
Xi’an Jiaotong University (XJTU)Defense
The jury is composed by
- Mr. Domenico UMBRELLO, Professor, University of Calabria Reviewer
- Mr. Min WAN, Professor, Northwestern Polytechnical University Reviewer
- Mr. Mohammed NOUARI, Professor, University of Lorraine Examiner
- Mrs. Madalina CALAMAZ, Associate Professor, Arts et Métiers Institute of Technology Examiner
- Mr. Ke HUANG, Professor, Xi'an Jiaotong University Examiner
- Mr. Qinghua SONG, Professor, Shandong University Examiner
- Mr. Jun ZHANG, Professor, Xi’an Jiaotong University Examiner
- Mr. José OUTEIRO, Assoc. Professor HDR/Habil., Arts et Métiers Institute of Technology Examiner
Abstract
The rapid development of aerospace industry is the motivation for increasing the manufacturing productivity keeping the same part quality or even improving it. High-speed machining (HSM) of difficult-to-cut materials like Titanium-based alloys is a way to achieve a high productivity. So far, most of research works on surface integrity in machining are based on the phenomenological analysis and rarely involve a theoretical analysis of the physical phenomena responsible for the modification of the near surface layer properties. In this research work, the microstructure evolution, and the surface integrity in HSM of Ti-6Al-4V alloy are investigated using modelling and experimental approaches. A multiscale modelling approach combining finite element simulations using CEL approach and cellular automata method permitted to simulate the microstructure evolution in machining, including in the machined surface and subsurface. Surface topography, plastic strain, microhardness, and residual stresses of the machined surface and subsurface were also simulated, revealing the influence of the cyclic nature of the cutting process in these surface integrity characteristics.
Keywords
Multiscale-modelling, High Speed Machining, Ti-6Al-4V, Microstructure, Dynamic Recrystallisation, Surface Integrity.